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Recently, "3600A / 4500V Crimp-type IGBT and Its Key Technologies" completed by Zhongshi Times Electric Co., Ltd. was appraised by the Chinese Electronics Society as the world's most power-tight crimping IGBT. This achievement achieved the domestic "crimping IGBT technology from scratch" to break the foreign high-voltage crimp IGBT technology and market monopoly.
At present, the large-capacity crimp-type IGBT module developed by CNR Times Electric has passed the demonstration application verification test of the soft commutation valve level of a number of power grid enterprises, achieving the requirements of mass production and engineering applications. In view of the mass production demand of the crimping IGBT device, the layout and initial construction of the pilot production line of the crimping IGBT have been completed in the CSR Times and are expected to be completed in the first quarter of 2018.
Crimp-type IGBTs are similar in appearance to devices such as thyristors, but do not take conventional leads or soldering internally by electrically interconnecting a number of components known as "subunits" in parallel to power capacity, electrical connections between the chip and the electrodes , But through pressure. Comparing with the traditional welding IGBT module, the crimping IGBT module has the advantages of large capacity, high reliability, failure short circuit mode and the like. So at present, crimp IGBT devices are mainly used in flexible DC transmission, large industrial drives, energy and other high-end equipment industry.
With the large-scale distributed renewable energy access, offshore wind farms sent to the grid, the construction of new urban power grids and other applications, the market demand for crimp-type IGBT modules has been rapidly increasing. Industry insiders estimate that in the next five years, the market size of flexible DC transmission in the world will reach over 100 billion yuan and the market will be huge.
However, due to the restrictions imposed by the conventional chip and the crimp-type packaging technology, at present, only a few manufacturers in Europe and Japan have large-capacity crimp-type IGBT devices. Over the years, CECE has adhered to independent technological innovation and set up power semiconductor R & D centers in Zhuzhou, China and Lincoln, England to jointly promote advanced IGBT design and process technology research and development. The company independently designed and built the world's first 8-inch high-voltage IGBT chip professional production line to capture the key technologies and complete sets of high-voltage IGBT manufacturing technology, in addition, the era of electric car also create a domestic IGBT "chip - module - device - application" Complete industrial chain.
The 3600A / 4500V crimp-type IGBT module developed by CNR Times Electric is the largest available product in the market at present and possesses the double-sided heat dissipation and long-term stable failure-short-circuit capability. It has realized the large-capacity crimping IGBT technology in China Nothing to "leapfrog once again to achieve high-end equipment manufacturing" China core "breakthrough.
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